<?xml version="1.0" encoding="UTF-8"?>
<urlset xmlns="http://www.sitemaps.org/schemas/sitemap/0.9"
        xmlns:n="http://www.google.com/schemas/sitemap-news/0.9"
	xmlns:image="http://www.google.com/schemas/sitemap-image/1.1">
  <url>
    <loc>https://edn.itmedia.co.jp/edn/articles/2610/15/news020.html</loc>
    <n:news>
      <n:publication>
        <n:name>EDN Japan</n:name>
        <n:language>ja</n:language>
      </n:publication>
      <n:genres>OpEd, Opinion</n:genres>
      <n:publication_date>2026-10-15T12:30:00+09:00</n:publication_date>
      <n:title>最大100GbEに対応、低遅延通信を実現するFPGA向けIP製品群</n:title>
      <n:keywords>Industry,Technology,Electronics Design,Engineers,semiconductor,analog,electrical component,consumer electronics,communication equipment,car electronics</n:keywords>
    </n:news>
    <image:image>       
      <image:loc>https://image.itmedia.co.jp/edn/articles/2610/15/l_edn20261014edn001.jpg</image:loc>     
    </image:image>   
  </url>
  <url>
    <loc>https://edn.itmedia.co.jp/edn/articles/2609/24/news006.html</loc>
    <n:news>
      <n:publication>
        <n:name>EDN Japan</n:name>
        <n:language>ja</n:language>
      </n:publication>
      <n:genres>OpEd, Opinion</n:genres>
      <n:publication_date>2026-10-15T11:00:00+09:00</n:publication_date>
      <n:title>フィジカルAI実装に必要な「3つのコンピュータ」とは？</n:title>
      <n:keywords>Industry,Technology,Electronics Design,Engineers,semiconductor,analog,electrical component,consumer electronics,communication equipment,car electronics</n:keywords>
    </n:news>
    <image:image>       
      <image:loc>https://image.itmedia.co.jp/edn/articles/2609/24/l_ks26092_R01_w490.jpg</image:loc>     
    </image:image>   
  </url>
  <url>
    <loc>https://edn.itmedia.co.jp/edn/articles/2610/15/news040.html</loc>
    <n:news>
      <n:publication>
        <n:name>EDN Japan</n:name>
        <n:language>ja</n:language>
      </n:publication>
      <n:genres>OpEd, Opinion</n:genres>
      <n:publication_date>2026-10-15T09:00:00+09:00</n:publication_date>
      <n:title>独自技術でラッチアップ防止 航空機向けTVSダイオード</n:title>
      <n:keywords>Industry,Technology,Electronics Design,Engineers,semiconductor,analog,electrical component,consumer electronics,communication equipment,car electronics</n:keywords>
    </n:news>
    <image:image>       
      <image:loc>https://image.itmedia.co.jp/edn/articles/2610/15/l_ks261015_LF01_w290.jpg</image:loc>     
    </image:image>   
  </url>
  <url>
    <loc>https://edn.itmedia.co.jp/edn/articles/2610/14/news006.html</loc>
    <n:news>
      <n:publication>
        <n:name>EDN Japan</n:name>
        <n:language>ja</n:language>
      </n:publication>
      <n:genres>OpEd, Opinion</n:genres>
      <n:publication_date>2026-10-14T12:30:00+09:00</n:publication_date>
      <n:title>Efinix、FPGA向け64ビットRISC-VソフトSoC</n:title>
      <n:keywords>Industry,Technology,Electronics Design,Engineers,semiconductor,analog,electrical component,consumer electronics,communication equipment,car electronics</n:keywords>
    </n:news>
    <image:image>       
      <image:loc>https://image.itmedia.co.jp/edn/articles/2610/14/l_edn20261005edn001.jpg</image:loc>     
    </image:image>   
  </url>
  <url>
    <loc>https://edn.itmedia.co.jp/edn/articles/2610/15/news010.html</loc>
    <n:news>
      <n:publication>
        <n:name>EDN Japan</n:name>
        <n:language>ja</n:language>
      </n:publication>
      <n:genres>OpEd, Opinion</n:genres>
      <n:publication_date>2026-10-14T11:00:00+09:00</n:publication_date>
      <n:title>プロセスエンジニアは地震発生時にどう動くのか――トラブル時の連携力と非常時対応</n:title>
      <n:keywords>Industry,Technology,Electronics Design,Engineers,semiconductor,analog,electrical component,consumer electronics,communication equipment,car electronics</n:keywords>
    </n:news>
    <image:image>       
      <image:loc>https://image.itmedia.co.jp/edn/articles/2606/08/mm260609_pe01.jpg</image:loc>     
    </image:image>   
  </url>
  <url>
    <loc>https://edn.itmedia.co.jp/edn/articles/2610/14/news028.html</loc>
    <n:news>
      <n:publication>
        <n:name>EDN Japan</n:name>
        <n:language>ja</n:language>
      </n:publication>
      <n:genres>OpEd, Opinion</n:genres>
      <n:publication_date>2026-10-14T09:00:00+09:00</n:publication_date>
      <n:title>低誘電と柔軟性を両立 先端半導体パッケージ基板向け樹脂</n:title>
      <n:keywords>Industry,Technology,Electronics Design,Engineers,semiconductor,analog,electrical component,consumer electronics,communication equipment,car electronics</n:keywords>
    </n:news>
    <image:image>       
      <image:loc>https://image.itmedia.co.jp/edn/articles/2610/14/l_ks261014_U01_w290.jpg</image:loc>     
    </image:image>   
  </url>
</urlset>
